Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G34GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G34GMSOT886XSON61.914320 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527902913217126030 s123520 s3
93527902911518126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.062910100.0000003.286284
subTotal0.062910100.0000003.286284
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.013059
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.013059
Silica -amorphous-7631-86-90.00250050.0000000.130595
PolymerEpoxy resin systemProprietary0.00150030.0000000.078357
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.026119
subTotal0.005000100.0000000.261189
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000038.113649
Magnesium (Mg)7439-95-40.0011580.1500000.060491
Nickel (Ni)7440-02-00.0227742.9500001.189665
Silicon (Si)7440-21-30.0049410.6400000.258097
Pure metal layerGold (Au)7440-57-50.0001540.0200000.008066
Nickel (Ni)7440-02-00.0126611.6400000.661373
Palladium (Pd)7440-05-30.0006950.0900000.036295
subTotal0.772000100.00000040.327636
Mould CompoundAdditiveNon hazardousProprietary0.0043660.4100000.228097
FillerSilica -amorphous-7631-86-90.0030880.2900000.161337
Silica fused60676-86-00.91749886.15000047.928115
HardenerPhenolic resinProprietary0.0456884.2900002.386670
PigmentCarbon black1333-86-40.0020240.1900000.105703
PolymerEpoxy resin systemProprietary0.0923368.6700004.823410
subTotal1.065000100.00000055.633332
WireImpurityNon hazardousProprietary0.0000010.0100000.000049
Pure metalCopper (Cu)7440-50-80.00908096.4900000.474308
Pure metal layerGold (Au)7440-57-50.0000470.5000000.002458
Palladium (Pd)7440-05-30.0002823.0000000.014747
subTotal0.009410100.0000000.491562
total1.914320100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.