Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP2G80GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP2G80GNSOT1116X2SON81.178432 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352922291156126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050678100.0000004.300418
subTotal0.050678100.0000004.300418
ComponentAdditiveNon hazardousProprietary0.0007005.0000000.059401
FillerBisphenol A-epichlorohydrin resin25068-38-60.0007005.0000000.059401
Silica -amorphous-7631-86-90.00700050.0000000.594010
PolymerEpoxy resin systemProprietary0.00420030.0000000.356406
Phenol Formaldehyde resin (generic)9003-35-40.00140010.0000000.118802
subTotal0.014000100.0000001.188019
Lead FrameCopper alloyCopper (Cu)7440-50-80.47287892.90330040.127712
Magnesium (Mg)7439-95-40.0007380.1449000.062587
Nickel (Ni)7440-02-00.0147472.8972001.251387
Silicon (Si)7440-21-30.0031950.6277000.271122
MetallisationGold (Au)7440-57-50.0002140.0421000.018184
Nickel (Ni)7440-02-00.0165013.2418001.400230
Palladium (Pd)7440-05-30.0007280.1430000.061766
subTotal0.509000100.00000043.192989
Mould CompoundAdditiveNon hazardousProprietary0.0023820.4100000.202141
FillerSilica -amorphous-7631-86-90.0016850.2900000.142978
Silica fused60676-86-00.50053286.15000042.474364
HardenerPhenolic resinProprietary0.0249254.2900002.115090
PigmentCarbon black1333-86-40.0011040.1900000.093675
PolymerEpoxy resin systemProprietary0.0503738.6700004.274553
subTotal0.581000100.00000049.302802
WireGold alloyGold (Au)7440-57-50.02351799.0000001.995656
Palladium (Pd)7440-05-30.0002381.0000000.020158
subTotal0.023755100.0000002.015814
total1.178432100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.