Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74CBTLVD3244BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74CBTLVD3244BQSOT764-1DHVQFN2028.362245 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352940991159126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003007
FillerSilver (Ag)7440-22-40.06396075.0000000.225511
PolymerAcrylic resinProprietary0.0051176.0000000.018041
Resin systemProprietary0.01535018.0000000.054123
subTotal0.085280100.0000000.300681
DieDoped siliconSilicon (Si)7440-21-30.681138100.0000002.401567
subTotal0.681138100.0000002.401567
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.335409
Iron (Fe)7439-89-60.2607362.4000000.919308
Phosphorus (P)7723-14-00.0032590.0300000.011491
Zinc (Zn)7440-66-60.0108640.1000000.038305
subTotal10.864020100.00000038.304514
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.722809
FillerSilica -amorphous-7631-86-90.5714843.4900002.014948
Silica fused60676-86-013.88919984.82000048.970731
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.578504
PigmentCarbon black1333-86-40.0268550.1640000.094685
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.136768
Epoxy resin systemProprietary0.2597061.5860000.915675
Phenolic resinProprietary0.3689272.2530001.300767
subTotal16.374910100.00000057.734887
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009723
Nickel (Ni)7440-02-00.25095191.0000000.884805
Palladium (Pd)7440-05-30.0220628.0000000.077785
subTotal0.275770100.0000000.972314
WirePure metalCopper (Cu)7440-50-80.07832896.5500000.276171
Pure metal layerGold (Au)7440-57-50.0002840.3500000.001001
Palladium (Pd)7440-05-30.0025153.1000000.008867
subTotal0.081127100.0000000.286039
total28.362245100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.