Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC4017BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4017BQSOT763-1DHVQFN1621.476699 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528535711510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004641
FillerSilver (Ag)7440-22-40.07476075.0000000.348098
PolymerAcrylic resinProprietary0.0059816.0000000.027848
Resin systemProprietary0.01794218.0000000.083544
subTotal0.099680100.0000000.464131
DieDoped siliconSilicon (Si)7440-21-30.419050100.0000001.951187
subTotal0.419050100.0000001.951187
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000037.452568
Iron (Fe)7439-89-60.1980572.4000000.922193
Phosphorus (P)7723-14-00.0024760.0300000.011527
Zinc (Zn)7440-66-60.0082520.1000000.038425
subTotal8.252360100.00000038.424713
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.728216
FillerSilica -amorphous-7631-86-90.4341023.4900002.021271
Silica fused60676-86-010.55030284.82000049.124410
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.580319
PigmentCarbon black1333-86-40.0203990.1640000.094982
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.143474
Epoxy resin systemProprietary0.1972741.5860000.918549
Phenolic resinProprietary0.2802392.2530001.304849
subTotal12.438460100.00000057.916070
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009754
Nickel (Ni)7440-02-00.19062791.0000000.887598
Palladium (Pd)7440-05-30.0167588.0000000.078031
subTotal0.209480100.0000000.975383
WirePure metalCopper (Cu)7440-50-80.05567996.5500000.259254
Pure metal layerGold (Au)7440-57-50.0002020.3500000.000940
Palladium (Pd)7440-05-30.0017883.1000000.008324
subTotal0.057669100.0000000.268518
total21.476699100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.