Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC4020BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4020BQSOT763-1DHVQFN1621.805583 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93529078411510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004571
FillerSilver (Ag)7440-22-40.07476075.0000000.342848
PolymerAcrylic resinProprietary0.0059816.0000000.027428
Resin systemProprietary0.01794218.0000000.082284
subTotal0.099680100.0000000.457131
DieDoped siliconSilicon (Si)7440-21-30.754419100.0000003.459752
subTotal0.754419100.0000003.459752
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.887687
Iron (Fe)7439-89-60.1980572.4000000.908284
Phosphorus (P)7723-14-00.0024760.0300000.011354
Zinc (Zn)7440-66-60.0082520.1000000.037845
subTotal8.252360100.00000037.845170
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.702150
FillerSilica -amorphous-7631-86-90.4341023.4900001.990785
Silica fused60676-86-010.55030284.82000048.383489
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.571566
PigmentCarbon black1333-86-40.0203990.1640000.093550
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.111145
Epoxy resin systemProprietary0.1972741.5860000.904695
Phenolic resinProprietary0.2802392.2530001.285169
subTotal12.438460100.00000057.042547
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009607
Nickel (Ni)7440-02-00.19062791.0000000.874211
Palladium (Pd)7440-05-30.0167588.0000000.076854
subTotal0.209480100.0000000.960671
WirePure metalCopper (Cu)7440-50-80.04941896.5500000.226631
Pure metal layerGold (Au)7440-57-50.0001790.3500000.000822
Palladium (Pd)7440-05-30.0015873.1000000.007277
subTotal0.051184100.0000000.234729
total21.805583100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.