Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC8T245BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC8T245BQSOT815-1DHVQFN2450.516508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352901381187126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0012721.0000000.002518
FillerSilver (Ag)7440-22-40.09539275.0000000.188834
PolymerAcrylic resinProprietary0.0076316.0000000.015107
Resin systemProprietary0.02289418.0000000.045320
subTotal0.127190100.0000000.251779
DieDoped siliconSilicon (Si)7440-21-30.681152100.0000001.348375
subTotal0.681152100.0000001.348375
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.07832097.47000037.766505
Iron (Fe)7439-89-60.4697652.4000000.929923
Phosphorus (P)7723-14-00.0058720.0300000.011624
Zinc (Zn)7440-66-60.0195740.1000000.038747
subTotal19.573530100.00000038.746799
Mould CompoundAdditiveNon hazardousProprietary0.8803522.9840001.742701
FillerSilica -amorphous-7631-86-91.0296343.4900002.038213
Silica fused60676-86-025.02394484.82000049.536172
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.2956141.0020000.585183
PigmentCarbon black1333-86-40.0483840.1640000.095778
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-71.0918843.7010002.161440
Epoxy resin systemProprietary0.4679081.5860000.926248
Phenolic resinProprietary0.6646892.2530001.315786
subTotal29.502410100.00000058.401523
Pre-PlatingPure metal layerGold (Au)7440-57-50.0049691.0000000.009836
Nickel (Ni)7440-02-00.45214391.0000000.895039
Palladium (Pd)7440-05-30.0397498.0000000.078685
subTotal0.496860100.0000000.983560
WirePure metalCopper (Cu)7440-50-80.13069696.5500000.258719
Pure metal layerGold (Au)7440-57-50.0004740.3500000.000938
Palladium (Pd)7440-05-30.0041963.1000000.008307
subTotal0.135366100.0000000.267964
total50.516508100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.