Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVT573BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVT573BQSOT764-1DHVQFN2028.080516 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528560711510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003037
FillerSilver (Ag)7440-22-40.06396075.0000000.227774
PolymerAcrylic resinProprietary0.0051176.0000000.018222
Resin systemProprietary0.01535018.0000000.054666
subTotal0.085280100.0000000.303698
DieDoped siliconSilicon (Si)7440-21-30.379033100.0000001.349807
subTotal0.379033100.0000001.349807
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.709992
Iron (Fe)7439-89-60.2607362.4000000.928532
Phosphorus (P)7723-14-00.0032590.0300000.011607
Zinc (Zn)7440-66-60.0108640.1000000.038689
subTotal10.864020100.00000038.688819
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.740094
FillerSilica -amorphous-7631-86-90.5714843.4900002.035163
Silica fused60676-86-013.88919984.82000049.462049
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.584308
PigmentCarbon black1333-86-40.0268550.1640000.095635
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.158206
Epoxy resin systemProprietary0.2597061.5860000.924862
Phenolic resinProprietary0.3689272.2530001.313817
subTotal16.374910100.00000058.314135
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009821
Nickel (Ni)7440-02-00.25095191.0000000.893683
Palladium (Pd)7440-05-30.0220628.0000000.078566
subTotal0.275770100.0000000.982069
WirePure metalCopper (Cu)7440-50-80.09800196.5500000.349000
Pure metal layerGold (Au)7440-57-50.0003550.3500000.001265
Palladium (Pd)7440-05-30.0031473.1000000.011206
subTotal0.101503100.0000000.361471
total28.080516100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.