Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAS40W

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAS40WSOT323SC-705.457166 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93404428011512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000000.549736
subTotal0.030000100.0000000.549736
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016600.0900000.030411
Carbon (C)7440-44-00.0007380.0400000.013516
Chromium (Cr)7440-47-30.0016600.0900000.030411
Cobalt (Co)7440-48-40.0079290.4300000.145299
Iron (Fe)7439-89-60.81965844.45000015.019847
Manganese (Mn)7439-96-50.0127240.6900000.233154
Nickel (Ni)7440-02-00.63415234.39000011.620530
Phosphorus (P)7723-14-00.0003690.0200000.006758
Silicon (Si)7440-21-30.0047940.2600000.087855
Sulphur (S)7704-34-90.0003690.0200000.006758
Pure metal layerCopper (Cu)7440-50-80.32030317.3700005.869398
Silver (Ag)7440-22-40.0396462.1500000.726494
subTotal1.844000100.00000033.790433
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.790856
Triphenylphosphine603-35-00.0016850.0500000.030877
FillerSilica -amorphous-7631-86-92.42640072.00000044.462639
PigmentCarbon black1333-86-40.0016850.0500000.030877
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000009.263050
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000006.175366
subTotal3.370000100.00000061.753665
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000115
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000192
Tin solderTin (Sn)7440-31-50.20997999.9900003.847766
subTotal0.210000100.0000003.848151
WirePure metalCopper (Cu)7440-50-80.003166100.0000000.058020
subTotal0.003166100.0000000.058020
total5.457166100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.