Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BAT854SW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BAT854SWSOT323SC-705.516817 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340561751151312601235
934056175135112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.100000100.0000001.812639
subTotal0.100000100.0000001.812639
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016200.0900000.029365
Carbon (C)7440-44-00.0007200.0400000.013051
Chromium (Cr)7440-47-30.0037800.2100000.068518
Cobalt (Co)7440-48-40.0075600.4200000.137036
Iron (Fe)7439-89-60.84906047.17000015.390396
Manganese (Mn)7439-96-50.0153000.8500000.277334
Nickel (Ni)7440-02-00.63972035.54000011.595817
Phosphorus (P)7723-14-00.0003600.0200000.006526
Silicon (Si)7440-21-30.0045000.2500000.081569
Sulphur (S)7704-34-90.0003600.0200000.006526
Pure metal layerCopper (Cu)7440-50-80.23490013.0500004.257890
Silver (Ag)7440-22-40.0421202.3400000.763484
subTotal1.800000100.00000032.627510
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.283935
PigmentCarbon black1333-86-40.0102000.3000000.184889
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.785205
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.375712
subTotal3.400000100.00000061.629740
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000114
Bismuth (Bi)7440-69-90.0000020.0010000.000038
Copper (Cu)7440-50-80.0000020.0010000.000038
Lead (Pb)7439-92-10.0000100.0050000.000190
Tin solderTin (Sn)7440-31-50.20997999.9900003.806162
subTotal0.210000100.0000003.806543
WirePure metalCopper (Cu)7440-50-80.006817100.0000000.123563
subTotal0.006817100.0000000.123563
total5.516817100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.