Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC51-16PA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC51-16PASOT1061HUSON37.564628 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340658161155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.163309
PolymerAcrylic resinProprietary0.02200020.0000000.290827
subTotal0.110000100.0000001.454136
DieDoped siliconSilicon (Si)7440-21-30.200000100.0000002.643884
subTotal0.200000100.0000002.643884
Lead FrameCopper alloyCopper (Cu)7440-50-82.64136894.20000034.917355
Magnesium (Mg)7439-95-40.0084120.3000000.111202
Nickel (Ni)7440-02-00.0981403.5000001.297354
Silicon (Si)7440-21-30.0243950.8700000.322485
Pure metal layerGold (Au)7440-57-50.0011220.0400000.014827
Nickel (Ni)7440-02-00.0280401.0000000.370673
Palladium (Pd)7440-05-30.0025240.0900000.033361
subTotal2.804000100.00000037.067256
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.230890
FillerSilica -amorphous-7631-86-90.0123540.2900000.163313
Silica fused60676-86-03.66999086.15000048.515142
HardenerPhenolic resinProprietary0.1827544.2900002.415902
PigmentCarbon black1333-86-40.0080940.1900000.106998
PolymerEpoxy resin systemProprietary0.3693428.6700004.882487
subTotal4.260000100.00000056.314732
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000101
Non hazardousProprietary0.0000940.0555000.001247
Tin solderTin (Sn)7440-31-50.16989899.9400002.245953
subTotal0.170000100.0000002.247302
WireImpurityNon hazardousProprietary0.0000020.0100000.000027
Pure metalCopper (Cu)7440-50-80.02062699.9900000.272663
subTotal0.020628100.0000000.272690
total7.564628100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.