Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC69PAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC69PASSOT1061DHUSON37.584000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340681111153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.160338
PolymerAcrylic resinProprietary0.02200020.0000000.290084
subTotal0.110000100.0000001.450422
DieDoped siliconSilicon (Si)7440-21-30.230000100.0000003.032700
subTotal0.230000100.0000003.032700
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.695063
Magnesium (Mg)7439-95-40.0140200.5000000.184863
Nickel (Ni)7440-02-00.1037483.7000001.367985
Silicon (Si)7440-21-30.0224320.8000000.295781
Pure metal layerGold (Au)7440-57-50.0016820.0600000.022184
Nickel (Ni)7440-02-00.0280401.0000000.369726
Palladium (Pd)7440-05-30.0028040.1000000.036973
subTotal2.804000100.00000036.972574
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.230301
FillerSilica -amorphous-7631-86-90.0123540.2900000.162896
Silica fused60676-86-03.66999086.15000048.391218
HardenerPhenolic resinProprietary0.1827544.2900002.409731
PigmentCarbon black1333-86-40.0080940.1900000.106725
PolymerEpoxy resin systemProprietary0.3693428.6700004.870016
subTotal4.260000100.00000056.170886
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000101
Non hazardousProprietary0.0000940.0555000.001244
Tin solderTin (Sn)7440-31-50.16989899.9400002.240216
subTotal0.170000100.0000002.241561
WireImpurityNon hazardousProprietary0.0000010.0100000.000013
Pure metalCopper (Cu)7440-50-80.00999999.9900000.131843
subTotal0.010000100.0000000.131856
total7.584000100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.