Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC847CQA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BC847CQASOT1215DFN1010D-31.137198 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340690681474126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000002.110450
PolymerAcrylic resinProprietary0.00600020.0000000.527613
subTotal0.030000100.0000002.638063
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000002.638063
subTotal0.030000100.0000002.638063
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.111854
Copper (Cu)7440-50-80.50090394.51000044.047123
Tin (Sn)7440-31-50.0012720.2400000.111854
Zinc (Zn)7440-66-60.0011130.2100000.097872
Pure metal layerGold (Au)7440-57-50.0003710.0700000.032624
Nickel (Ni)7440-02-00.0229494.3300002.018030
Palladium (Pd)7440-05-30.0021200.4000000.186423
subTotal0.530000100.00000046.605780
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.00000010.314826
Silica fused60676-86-00.30600060.00000026.908243
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.345412
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.224235
PigmentCarbon black1333-86-40.0025500.5000000.224235
PolymerEpoxy resin systemProprietary0.0357007.0000003.139295
Phenolic resinProprietary0.0306006.0000002.690824
subTotal0.510000100.00000044.847071
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000119
Non hazardousProprietary0.0000170.0555000.001464
Tin solderTin (Sn)7440-31-50.02998299.9400002.636480
subTotal0.030000100.0000002.638063
WireImpurityNon hazardousProprietary0.0000010.0100000.000063
Pure metalGold (Au)7440-57-50.00719799.9900000.632896
subTotal0.007198100.0000000.632959
total1.137198100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.