Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSH111BK

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSH111BKSOT23TO-236AB7.669705 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340680562155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.651916
subTotal0.050000100.0000000.651916
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029911
Carbon (C)7440-44-00.0010200.0400000.013294
Chromium (Cr)7440-47-30.0056080.2200000.073116
Cobalt (Co)7440-48-40.0109610.4300000.142909
Iron (Fe)7439-89-61.22301047.98000015.945987
Manganese (Mn)7439-96-50.0219210.8600000.285818
Nickel (Ni)7440-02-00.92120936.14000012.011004
Phosphorus (P)7723-14-00.0005100.0200000.006647
Silicon (Si)7440-21-30.0066270.2600000.086410
Sulphur (S)7704-34-90.0005100.0200000.006647
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.778780
Silver (Ag)7440-22-40.0655092.5700000.854131
subTotal2.549000100.00000033.234655
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.844804
Triphenylphosphine603-35-00.0024400.0500000.031807
FillerSilica -amorphous-7631-86-93.51288072.00000045.802022
PigmentCarbon black1333-86-40.0024400.0500000.031807
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.542088
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.361392
subTotal4.879000100.00000063.613920
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001339
Tin solderTin (Sn)7440-31-50.18488999.9400002.410640
subTotal0.185000100.0000002.412088
WirePure metalCopper (Cu)7440-50-80.006705100.0000000.087422
subTotal0.006705100.0000000.087422
total7.669705100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.