Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BST52

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BST52SOT89MPT340.433865 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93364427013512126030 s123520 s3
93364427011512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08470077.0000000.209478
PolymerResin systemProprietary0.02530023.0000000.062571
subTotal0.110000100.0000000.272049
DieDoped siliconSilicon (Si)7440-21-30.240000100.0000000.593562
subTotal0.240000100.0000000.593562
Lead FrameCopper alloyCopper (Cu)7440-50-817.12911299.82000042.363281
Iron (Fe)7439-89-60.0171600.1000000.042440
Phosphorus (P)7723-14-00.0051480.0300000.012732
Pure metal layerSilver (Ag)7440-22-40.0085800.0500000.021220
subTotal17.160000100.00000042.439673
Mould CompoundAdditiveNon hazardousProprietary0.6614902.9000001.635980
Triphenylphosphine603-35-00.0114050.0500000.028207
FillerSilica -amorphous-7631-86-916.42320072.00000040.617438
PigmentCarbon black1333-86-40.0114050.0500000.028207
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.42150015.0000008.461966
Phenol Formaldehyde resin (generic)9003-35-42.28100010.0000005.641311
subTotal22.810000100.00000056.413108
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000008
Non hazardousProprietary0.0000390.0555000.000096
Tin solderTin (Sn)7440-31-50.06995899.9400000.173018
subTotal0.070000100.0000000.173122
WirePure metalGold (Au)7440-57-50.043865100.0000000.108486
subTotal0.043865100.0000000.108486
total40.433865100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.