Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7Y3R0-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7Y3R0-40HSOT669LFPAK100.990000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346600851153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.660000100.0000000.653530
subTotal0.660000100.0000000.653530
ClipCopper alloyCopper (Cu)7440-50-827.34520099.80000027.077136
Iron (Fe)7439-89-60.0411000.1500000.040697
Phosphorus (P)7723-14-00.0137000.0500000.013566
subTotal27.400000100.00000027.131399
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000037.467047
Iron (Fe)7439-89-60.0568650.1500000.056308
Phosphorus (P)7723-14-00.0151640.0400000.015015
subTotal37.910000100.00000037.538370
Mould CompoundFillerSilica fused60676-86-013.96860062.00000013.831667
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-23.49215015.5000003.457917
ImpuritySilicon Dioxide (SiO2)14808-60-70.0450600.2000000.044618
PigmentCarbon black1333-86-40.1126500.5000000.111546
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4506002.0000000.446183
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.47830011.0000002.454005
Phenolic resinProprietary1.9826408.8000001.963204
subTotal22.530000100.00000022.309140
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000381
Tin alloyTin (Sn)7440-31-53.84961599.9900003.811877
subTotal3.850000100.0000003.812259
Solder PasteLead alloyLead (Pb)7439-92-12.39575092.5000002.372265
Silver (Ag)7440-22-40.0647502.5000000.064115
Tin (Sn)7440-31-50.1295005.0000000.128231
subTotal2.590000100.0000002.564610
Solder PasteImpurityAntimony (Sb)7440-36-00.0018150.0300000.001797
Lead alloyLead (Pb)7439-92-15.59443592.4700005.539593
Silver (Ag)7440-22-40.1512502.5000000.149767
Tin (Sn)7440-31-50.3025005.0000000.299535
subTotal6.050000100.0000005.990692
total100.990000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.