Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9Y1R9-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9Y1R9-40HSOT669LFPAK102.820000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346603641153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.970000100.0000000.943396
subTotal0.970000100.0000000.943396
ClipCopper alloyCopper (Cu)7440-50-827.34520099.80000026.595215
Iron (Fe)7439-89-60.0411000.1500000.039973
Phosphorus (P)7723-14-00.0137000.0500000.013324
subTotal27.400000100.00000026.648512
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000036.800205
Iron (Fe)7439-89-60.0568650.1500000.055305
Phosphorus (P)7723-14-00.0151640.0400000.014748
subTotal37.910000100.00000036.870259
Mould CompoundFillerSilica fused60676-86-013.96860062.00000013.585489
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-23.49215015.5000003.396372
ImpuritySilicon Dioxide (SiO2)14808-60-70.0450600.2000000.043824
PigmentCarbon black1333-86-40.1126500.5000000.109560
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4506002.0000000.438242
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.47830011.0000002.410329
Phenolic resinProprietary1.9826408.8000001.928263
subTotal22.530000100.00000021.912079
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000374
Tin alloyTin (Sn)7440-31-53.84961599.9900003.744033
subTotal3.850000100.0000003.744408
Solder PasteLead alloyLead (Pb)7439-92-12.82125092.5000002.743873
Silver (Ag)7440-22-40.0762502.5000000.074159
Tin (Sn)7440-31-50.1525005.0000000.148317
subTotal3.050000100.0000002.966349
Solder PasteImpurityAntimony (Sb)7440-36-00.0021330.0300000.002074
Lead alloyLead (Pb)7439-92-16.57461792.4700006.394298
Silver (Ag)7440-22-40.1777502.5000000.172875
Tin (Sn)7440-31-50.3555005.0000000.345750
subTotal7.110000100.0000006.914997
total102.820000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.