Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NBM7100ABQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NBM7100ABQSOT763-1DHVQFN1621.831265 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356911951154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0009971.0000000.004566
FillerSilver (Ag)7440-22-40.07476075.0000000.342445
PolymerAcrylic resinProprietary0.0059816.0000000.027396
Resin systemProprietary0.01794218.0000000.082187
subTotal0.099680100.0000000.456593
DieDoped siliconSilicon (Si)7440-21-30.755526100.0000003.460751
subTotal0.755526100.0000003.460751
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.04357597.47000036.844293
Iron (Fe)7439-89-60.1980572.4000000.907216
Phosphorus (P)7723-14-00.0024760.0300000.011340
Zinc (Zn)7440-66-60.0082520.1000000.037801
subTotal8.252360100.00000037.800650
Mould CompoundAdditiveNon hazardousProprietary0.3711642.9840001.700147
FillerSilica -amorphous-7631-86-90.4341023.4900001.988443
Silica fused60676-86-010.55030284.82000048.326571
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1246331.0020000.570894
PigmentCarbon black1333-86-40.0203990.1640000.093440
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4603473.7010002.108661
Epoxy resin systemProprietary0.1972741.5860000.903631
Phenolic resinProprietary0.2802392.2530001.283657
subTotal12.438460100.00000056.975443
Pre-PlatingPure metal layerGold (Au)7440-57-50.0020951.0000000.009595
Nickel (Ni)7440-02-00.19062791.0000000.873183
Palladium (Pd)7440-05-30.0167588.0000000.076763
subTotal0.209480100.0000000.959541
WirePure metalCopper (Cu)7440-50-80.07314696.5500000.335051
Pure metal layerGold (Au)7440-57-50.0002650.3500000.001215
Palladium (Pd)7440-05-30.0023493.1000000.010758
subTotal0.075760100.0000000.347023
total21.831265100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.