Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NGW50T65H3DFP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NGW50T65H3DFPSOT429-2TO247-3L6028.829079 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346682441274NA30 sNA20 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.100000100.0000000.068007
subTotal4.100000100.0000000.068007
DieDoped siliconSilicon (Si)7440-21-310.400000100.0000000.172504
subTotal10.400000100.0000000.172504
Lead FrameCopper alloyCopper (Cu)7440-50-84034.59160499.87849066.921645
Iron (Fe)7439-89-62.8276500.0700000.046902
Phosphorus (P)7723-14-01.2118500.0300000.020101
ImpurityLead (Pb)7439-92-10.0609960.0015100.001012
Non hazardousProprietary0.0080790.0002000.000134
Pure metal layerNickel (Ni)7440-02-00.7998210.0198000.013267
subTotal4039.500000100.00000067.003061
Mould CompoundAdditiveNon hazardousProprietary57.8073003.0000000.958848
FillerSilica fused60676-86-01646.54459585.45000027.311184
HardenerPhenolic resinProprietary57.8073003.0000000.958848
PigmentCarbon black1333-86-410.5980050.5500000.175789
PolymerEpoxy resin systemProprietary144.5182507.5000002.397120
subTotal1926.910000100.00000031.801788
Post-PlatingImpurityNon hazardousProprietary0.0029530.0100000.000049
Tin solderTin (Sn)7440-31-529.52704799.9900000.489764
subTotal29.530000100.0000000.489813
Solder WireLead alloyLead (Pb)7439-92-10.93500093.5000000.015509
Silver (Ag)7440-22-40.0150001.5000000.000249
Tin (Sn)7440-31-50.0500005.0000000.000829
subTotal1.000000100.0000000.016587
WireImpurityCopper (Cu)7440-50-80.0000020.0010000.000000
Iron (Fe)7439-89-60.0000020.0010000.000000
Magnesium (Mg)7439-95-40.0000020.0010000.000000
Nickel (Ni)7440-02-00.0000090.0060000.000000
Silicon (Si)7440-21-30.0000020.0010000.000000
Pure metalAluminium (Al)7429-90-50.15246199.9900000.002529
subTotal0.152476100.0000000.002529
WireImpurityCopper (Cu)7440-50-80.0001720.0010000.000003
Iron (Fe)7439-89-60.0001720.0010000.000003
Magnesium (Mg)7439-95-40.0001720.0010000.000003
Nickel (Ni)7440-02-00.0010340.0060000.000017
Silicon (Si)7440-21-30.0001720.0010000.000003
Pure metalAluminium (Al)7429-90-517.23487999.9900000.285874
subTotal17.236602100.0000000.285903
total6028.829079100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.