Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5360PAS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5360PAS-QSOT1061DHUSON37.698100 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346645361152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.143139
PolymerAcrylic resinProprietary0.02200020.0000000.285785
subTotal0.110000100.0000001.428924
DieDoped siliconSilicon (Si)7440-21-30.320000100.0000004.156870
subTotal0.320000100.0000004.156870
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000034.180819
Magnesium (Mg)7439-95-40.0140200.5000000.182123
Nickel (Ni)7440-02-00.1037483.7000001.347709
Silicon (Si)7440-21-30.0224320.8000000.291397
Pure metal layerGold (Au)7440-57-50.0016820.0600000.021855
Nickel (Ni)7440-02-00.0280401.0000000.364246
Palladium (Pd)7440-05-30.0028040.1000000.036425
subTotal2.804000100.00000036.424572
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.226887
FillerSilica -amorphous-7631-86-90.0123540.2900000.160481
Silica fused60676-86-03.66999086.15000047.673971
HardenerPhenolic resinProprietary0.1827544.2900002.374014
PigmentCarbon black1333-86-40.0080940.1900000.105143
PolymerEpoxy resin systemProprietary0.3693428.6700004.797833
subTotal4.260000100.00000055.338330
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000099
Non hazardousProprietary0.0000940.0555000.001226
Tin solderTin (Sn)7440-31-50.16989899.9400002.207012
subTotal0.170000100.0000002.208337
WireImpurityNon hazardousProprietary0.0000030.0100000.000044
Pure metalCopper (Cu)7440-50-80.03412299.9900000.443247
subTotal0.034125100.0000000.443291
total7.698100100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.