Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA114YQA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA114YQASOT1215DFN1010D-31.137625 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340691481472126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000002.109658
PolymerAcrylic resinProprietary0.00600020.0000000.527415
subTotal0.030000100.0000002.637073
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000002.637073
subTotal0.030000100.0000002.637073
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.111812
Copper (Cu)7440-50-80.50090394.51000044.030590
Tin (Sn)7440-31-50.0012720.2400000.111812
Zinc (Zn)7440-66-60.0011130.2100000.097835
Pure metal layerGold (Au)7440-57-50.0003710.0700000.032612
Nickel (Ni)7440-02-00.0229494.3300002.017273
Palladium (Pd)7440-05-30.0021200.4000000.186353
subTotal0.530000100.00000046.588287
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.00000010.310955
Silica fused60676-86-00.30600060.00000026.898143
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.344907
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.224151
PigmentCarbon black1333-86-40.0025500.5000000.224151
PolymerEpoxy resin systemProprietary0.0357007.0000003.138117
Phenolic resinProprietary0.0306006.0000002.689814
subTotal0.510000100.00000044.830238
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000119
Non hazardousProprietary0.0000170.0555000.001464
Tin solderTin (Sn)7440-31-50.02998299.9400002.635491
subTotal0.030000100.0000002.637073
WireImpurityNon hazardousProprietary0.0000010.0100000.000067
Pure metalGold (Au)7440-57-50.00762499.9900000.670189
subTotal0.007625100.0000000.670256
total1.137625100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.