Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA123EU

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA123EUSOT323SC-705.555513 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405753211512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.070000100.0000001.260010
subTotal0.070000100.0000001.260010
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.029970
Carbon (C)7440-44-00.0007400.0400000.013320
Chromium (Cr)7440-47-30.0016650.0900000.029970
Cobalt (Co)7440-48-40.0079550.4300000.143191
Iron (Fe)7439-89-60.82602544.65000014.868564
Manganese (Mn)7439-96-50.0127650.6900000.229772
Nickel (Ni)7440-02-00.63899034.54000011.501908
Phosphorus (P)7723-14-00.0003700.0200000.006660
Silicon (Si)7440-21-30.0048100.2600000.086581
Sulphur (S)7704-34-90.0003700.0200000.006660
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.611093
Silver (Ag)7440-22-40.0429202.3200000.772566
subTotal1.850000100.00000033.300255
Mould CompoundFillerSilica fused60676-86-02.55340075.10000045.961552
PigmentCarbon black1333-86-40.0102000.3000000.183601
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.710082
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.345233
subTotal3.400000100.00000061.200469
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000124
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000207
Tin solderTin (Sn)7440-31-50.22997799.9900004.139618
subTotal0.230000100.0000004.140032
WirePure metalCopper (Cu)7440-50-80.005513100.0000000.099235
subTotal0.005513100.0000000.099235
total5.555513100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.