Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTC114YMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTC114YMBSOT883BXQFN30.710637 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065942315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.320839
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.044200
Phenolic resinProprietary0.00040613.5300000.057118
subTotal0.003000100.0000000.422156
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000008.443129
subTotal0.060000100.0000008.443129
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.094563
Copper (Cu)7440-50-80.26320094.00000037.037193
Tin (Sn)7440-31-50.0006720.2400000.094563
Zinc (Zn)7440-66-60.0005880.2100000.082743
Pure metal layerGold (Au)7440-57-50.0002240.0800000.031521
Nickel (Ni)7440-02-00.0138324.9400001.946423
Palladium (Pd)7440-05-30.0008120.2900000.114264
subTotal0.280000100.00000039.401270
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.004212
Silica fused60676-86-00.20400060.00000028.706639
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.435332
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.239222
PigmentCarbon black1333-86-40.0017000.5000000.239222
PolymerEpoxy resin systemProprietary0.0238007.0000003.349108
Phenolic resinProprietary0.0204006.0000002.870664
subTotal0.340000100.00000047.844399
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000127
Non hazardousProprietary0.0000110.0555000.001562
Tin solderTin (Sn)7440-31-50.01998899.9400002.812688
subTotal0.020000100.0000002.814376
WireImpurityNon hazardousProprietary0.0000010.0100000.000107
Pure metalGold (Au)7440-57-50.00763699.9900001.074590
subTotal0.007637100.0000001.074698
total0.710637100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.