Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD24VL1BL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD24VL1BLSOD882DFN1006-20.938280 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346678723153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.809993
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.111587
Phenolic resinProprietary0.00135313.5300000.144200
subTotal0.010000100.0000001.065780
DieDoped siliconSilicon (Si)7440-21-30.043000100.0000004.582854
subTotal0.043000100.0000004.582854
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000041.289274
Magnesium (Mg)7439-95-40.0008200.2000000.087394
Nickel (Ni)7440-02-00.0129153.1500001.376455
Silicon (Si)7440-21-30.0028290.6900000.301509
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013109
Nickel (Ni)7440-02-00.0052071.2700000.554952
Palladium (Pd)7440-05-30.0006970.1700000.074285
subTotal0.410000100.00000043.696977
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.030822
Silica fused60676-86-00.27000060.00000028.776058
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.438803
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.239800
PigmentCarbon black1333-86-40.0022500.5000000.239800
PolymerEpoxy resin systemProprietary0.0315007.0000003.357207
Phenolic resinProprietary0.0270006.0000002.877606
subTotal0.450000100.00000047.960097
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000096
Non hazardousProprietary0.0000110.0555000.001183
Tin solderTin (Sn)7440-31-50.01998899.9400002.130281
subTotal0.020000100.0000002.131560
WireImpurityNon hazardousProprietary0.0000010.0100000.000056
Pure metalGold (Au)7440-57-50.00527999.9900000.562676
subTotal0.005280100.0000000.562732
total0.938280100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.