Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMCXB900UE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMCXB900UESOT1216DFN1010B-61.184054 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340671431476126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01600080.0000001.351290
PolymerAcrylic resinProprietary0.00400020.0000000.337822
subTotal0.020000100.0000001.689112
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000002.533668
subTotal0.030000100.0000002.533668
Lead FrameCopper alloyChromium (Cr)7440-47-30.0011760.2400000.099320
Copper (Cu)7440-50-80.46496194.89000039.268564
Tin (Sn)7440-31-50.0011760.2400000.099320
Zinc (Zn)7440-66-60.0010290.2100000.086905
Pure metal layerGold (Au)7440-57-50.0002450.0500000.020692
Nickel (Ni)7440-02-00.0205804.2000001.738096
Palladium (Pd)7440-05-30.0008330.1700000.070352
subTotal0.490000100.00000041.383248
Mould CompoundFillerSilica -amorphous-7631-86-90.14030023.00000011.849122
Silica fused60676-86-00.36600060.00000030.910752
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0183003.0000001.545538
Ion trapping agentBismuth (Bi)7440-69-90.0030500.5000000.257590
PigmentCarbon black1333-86-40.0030500.5000000.257590
PolymerEpoxy resin systemProprietary0.0427007.0000003.606254
Phenolic resinProprietary0.0366006.0000003.091075
subTotal0.610000100.00000051.517921
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000076
Non hazardousProprietary0.0000110.0555000.000937
Tin solderTin (Sn)7440-31-50.01998899.9400001.688099
subTotal0.020000100.0000001.689112
WireImpurityNon hazardousProprietary0.0000010.0100000.000119
Pure metalGold (Au)7440-57-50.01405399.9900001.186854
subTotal0.014054100.0000001.186973
total1.184054100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.