Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG4002EL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG4002ELSOD882DFN1006-20.914720 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405800931515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.830855
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.114461
Phenolic resinProprietary0.00135313.5300000.147914
subTotal0.010000100.0000001.093231
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000002.186461
subTotal0.020000100.0000002.186461
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000042.352742
Magnesium (Mg)7439-95-40.0008200.2000000.089645
Nickel (Ni)7440-02-00.0129153.1500001.411907
Silicon (Si)7440-21-30.0028290.6900000.309275
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013447
Nickel (Ni)7440-02-00.0052071.2700000.569245
Palladium (Pd)7440-05-30.0006970.1700000.076198
subTotal0.410000100.00000044.822459
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.314938
Silica fused60676-86-00.27000060.00000029.517229
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.475861
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.245977
PigmentCarbon black1333-86-40.0022500.5000000.245977
PolymerEpoxy resin systemProprietary0.0315007.0000003.443677
Phenolic resinProprietary0.0270006.0000002.951723
subTotal0.450000100.00000049.195382
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000098
Non hazardousProprietary0.0000110.0555000.001213
Tin solderTin (Sn)7440-31-50.01998899.9400002.185150
subTotal0.020000100.0000002.186461
WireImpurityNon hazardousProprietary0.0000000.0100000.000052
Pure metalGold (Au)7440-57-50.00472099.9900000.515953
subTotal0.004720100.0000000.516005
total0.914720100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.