Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMP5501QAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMP5501QASSOT1216DFN1010B-61.214529 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346600111473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01760080.0000001.449121
PolymerAcrylic resinProprietary0.00440020.0000000.362280
subTotal0.022000100.0000001.811402
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000004.940187
subTotal0.060000100.0000004.940187
Lead FrameCopper alloyCopper (Cu)7440-50-80.44769491.18000036.861516
Magnesium (Mg)7439-95-40.0008350.1700000.068726
Nickel (Ni)7440-02-00.0139442.8400001.148132
Silicon (Si)7440-21-30.0030440.6200000.250649
Pure metal layerGold (Au)7440-57-50.0003440.0700000.028299
Nickel (Ni)7440-02-00.0230284.6900001.896035
Palladium (Pd)7440-05-30.0021110.4300000.173837
subTotal0.491000100.00000040.427194
Mould CompoundFillerSilica -amorphous-7631-86-90.13938023.00000011.476054
Silica fused60676-86-00.36360060.00000029.937531
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0181803.0000001.496877
Ion trapping agentBismuth (Bi)7440-69-90.0030300.5000000.249479
PigmentCarbon black1333-86-40.0030300.5000000.249479
PolymerEpoxy resin systemProprietary0.0424207.0000003.492712
Phenolic resinProprietary0.0363606.0000002.993753
subTotal0.606000100.00000049.895886
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000089
Non hazardousProprietary0.0000130.0555000.001097
Tin solderTin (Sn)7440-31-50.02398699.9400001.974889
subTotal0.024000100.0000001.976075
WireImpurityNon hazardousProprietary0.0000010.0100000.000095
Pure metalGold (Au)7440-57-50.01152899.9900000.949162
subTotal0.011529100.0000000.949257
total1.214529100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.