Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB19XP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB19XPSOT1220DFN2020MD-67.421837 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340668711157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.754530
PolymerAcrylic resinProprietary0.01400020.0000000.188633
subTotal0.070000100.0000000.943163
DieDoped siliconSilicon (Si)7440-21-30.498000100.0000006.709929
subTotal0.498000100.0000006.709929
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560036.445328
Magnesium (Mg)7439-95-40.0042170.1459000.056812
Nickel (Ni)7440-02-00.0843532.9188001.136556
Silicon (Si)7440-21-30.0182760.6324000.246251
Pure metal layerGold (Au)7440-57-50.0009620.0333000.012967
Nickel (Ni)7440-02-00.0740132.5610000.997232
Palladium (Pd)7440-05-30.0032660.1130000.044001
subTotal2.890000100.00000038.939147
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.559133
Silica fused60676-86-02.23800060.00000030.154260
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.507713
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.251285
PigmentCarbon black1333-86-40.0186500.5000000.251285
PolymerEpoxy resin systemProprietary0.2611007.0000003.517997
Phenolic resinProprietary0.2238006.0000003.015426
subTotal3.730000100.00000050.257099
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000103
Non hazardousProprietary0.0000940.0555000.001271
Tin solderTin (Sn)7440-31-50.16989899.9400002.289164
subTotal0.170000100.0000002.290538
WireImpurityNon hazardousProprietary0.0000060.0100000.000086
Pure metalCopper (Cu)7440-50-80.06383199.9900000.860040
subTotal0.063837100.0000000.860126
total7.421837100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.