Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PQMH9

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PQMH9SOT1216DFN1010B-61.217134 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340697421473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01760080.0000001.446020
PolymerAcrylic resinProprietary0.00440020.0000000.361505
subTotal0.022000100.0000001.807525
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000004.929613
subTotal0.060000100.0000004.929613
Lead FrameCopper alloyCopper (Cu)7440-50-80.44769491.18000036.782622
Magnesium (Mg)7439-95-40.0008350.1700000.068579
Nickel (Ni)7440-02-00.0139442.8400001.145675
Silicon (Si)7440-21-30.0030440.6200000.250112
Pure metal layerGold (Au)7440-57-50.0003440.0700000.028238
Nickel (Ni)7440-02-00.0230284.6900001.891977
Palladium (Pd)7440-05-30.0021110.4300000.173465
subTotal0.491000100.00000040.340669
Mould CompoundFillerSilica -amorphous-7631-86-90.13938023.00000011.451492
Silica fused60676-86-00.36360060.00000029.873457
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0181803.0000001.493673
Ion trapping agentBismuth (Bi)7440-69-90.0030300.5000000.248945
PigmentCarbon black1333-86-40.0030300.5000000.248945
PolymerEpoxy resin systemProprietary0.0424207.0000003.485237
Phenolic resinProprietary0.0363606.0000002.987346
subTotal0.606000100.00000049.789095
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000089
Non hazardousProprietary0.0000130.0555000.001094
Tin solderTin (Sn)7440-31-50.02398699.9400001.970662
subTotal0.024000100.0000001.971845
WireImpurityNon hazardousProprietary0.0000010.0100000.000116
Pure metalGold (Au)7440-57-50.01413299.9900001.161112
subTotal0.014134100.0000001.161228
total1.217134100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.