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Chemical content 74AXP1T45GX

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Type numberPackagePackage descriptionTotal product weight
74AXP1T45GXSOT1255-2X2SON60.76037 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690967147412601235Seremban, Malaysia; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04977100.000006.54580
subTotal0.04977100.000006.54580
ComponentAdditiveNon hazardousProprietary0.000255.000000.03288
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03288
Silica -amorphous-7631-86-90.0025050.000000.32879
PolymerEpoxy resin systemProprietary0.0015030.000000.19727
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06576
subTotal0.00500100.000000.65758
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.04548
Magnesium (Mg)7439-95-40.000440.150000.05721
Nickel (Ni)7440-02-00.008562.950001.12511
Silicon (Si)7440-21-30.001860.640000.24409
Pure metal layerGold (Au)7440-57-50.000060.020000.00763
Nickel (Ni)7440-02-00.004761.640000.62548
Palladium (Pd)7440-05-30.000260.090000.03433
subTotal0.29000100.0000038.13933
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21461
FillerSilica -amorphous-7631-86-90.001150.290000.15179
Silica fused60676-86-00.3428886.1500045.09344
HardenerPhenolic resinProprietary0.017074.290002.24551
PigmentCarbon black1333-86-40.000760.190000.09945
PolymerEpoxy resin systemProprietary0.034518.670004.53813
subTotal0.39800100.0000052.34293
WireGold alloyGold (Au)7440-57-50.0174299.000002.29090
Palladium (Pd)7440-05-30.000181.000000.02314
subTotal0.01760100.000002.31404
total0.76037100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.