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Chemical content 74CBTLV3245BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74CBTLV3245BQ-Q100SOT764-1DHVQFN2028.16274 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353085271156126030 s123520 s3Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00303
FillerSilver (Ag)7440-22-40.0639675.000000.22711
PolymerAcrylic resinProprietary0.005126.000000.01817
Resin systemProprietary0.0153518.000000.05451
subTotal0.08528100.000000.30282
DieDoped siliconSilicon (Si)7440-21-30.48653100.000001.72756
subTotal0.48653100.000001.72756
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.59917
Iron (Fe)7439-89-60.260732.400000.92580
Phosphorus (P)7723-14-00.003260.030000.01157
Zinc (Zn)7440-66-60.010860.100000.03858
subTotal10.86381100.0000038.57512
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.73501
FillerSilica -amorphous-7631-86-90.571483.490002.02922
Silica fused60676-86-013.8892184.8200049.31767
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.58260
PigmentCarbon black1333-86-40.026850.164000.09536
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.15191
Epoxy resin systemProprietary0.259711.586000.92216
Phenolic resinProprietary0.368932.253001.30998
subTotal16.37492100.0000058.14391
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00979
Nickel (Ni)7440-02-00.2509691.000000.89111
Palladium (Pd)7440-05-30.022068.000000.07834
subTotal0.27578100.000000.97924
WirePure metalCopper (Cu)7440-50-80.0737996.550000.26200
Pure metal layerGold (Au)7440-57-50.000270.350000.00095
Palladium (Pd)7440-05-30.002373.100000.00841
subTotal0.07642100.000000.27136
total28.16274100.00000100.00000
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