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Chemical content 74CBTLVD3244BQ

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Type numberPackagePackage descriptionTotal product weight
74CBTLVD3244BQSOT764-1DHVQFN2028.36225 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352940991159126030 s123520 s3Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00301
FillerSilver (Ag)7440-22-40.0639675.000000.22551
PolymerAcrylic resinProprietary0.005126.000000.01804
Resin systemProprietary0.0153518.000000.05412
subTotal0.08528100.000000.30068
DieDoped siliconSilicon (Si)7440-21-30.68114100.000002.40157
subTotal0.68114100.000002.40157
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.33540
Iron (Fe)7439-89-60.260742.400000.91931
Phosphorus (P)7723-14-00.003260.030000.01149
Zinc (Zn)7440-66-60.010860.100000.03830
subTotal10.86402100.0000038.30450
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.72281
FillerSilica -amorphous-7631-86-90.571483.490002.01495
Silica fused60676-86-013.8892084.8200048.97072
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.57850
PigmentCarbon black1333-86-40.026850.164000.09469
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.13677
Epoxy resin systemProprietary0.259711.586000.91568
Phenolic resinProprietary0.368932.253001.30077
subTotal16.37491100.0000057.73489
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00972
Nickel (Ni)7440-02-00.2509591.000000.88481
Palladium (Pd)7440-05-30.022068.000000.07779
subTotal0.27577100.000000.97232
WirePure metalCopper (Cu)7440-50-80.0783396.550000.27617
Pure metal layerGold (Au)7440-57-50.000280.350000.00100
Palladium (Pd)7440-05-30.002513.100000.00887
subTotal0.08113100.000000.28604
total28.36225100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.