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Chemical content 74HC32BQ

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Type numberPackagePackage descriptionTotal product weight
74HC32BQSOT762-1DHVQFN1421.80250 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93527368811515126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001181.000000.00541
FillerSilver (Ag)7440-22-40.0885075.000000.40592
PolymerAcrylic resinProprietary0.007086.000000.03247
Resin systemProprietary0.0212418.000000.09742
subTotal0.11800100.000000.54122
DieDoped siliconSilicon (Si)7440-21-30.18485100.000000.84784
subTotal0.18485100.000000.84784
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.65007
Iron (Fe)7439-89-60.205522.346100.94264
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04078
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49038
Palladium (Pd)7440-05-30.004910.056000.02250
Silver (Ag)7440-22-40.001800.020500.00824
subTotal8.76000100.0000040.17887
Mould CompoundAdditiveNon hazardousProprietary0.378552.984001.73627
FillerSilica -amorphous-7631-86-90.442743.490002.03069
Silica fused60676-86-010.7602784.8200049.35335
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.127111.002000.58302
PigmentCarbon black1333-86-40.020810.164000.09543
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.469513.701002.15346
Epoxy resin systemProprietary0.201201.586000.92283
Phenolic resinProprietary0.285822.253001.31093
subTotal12.68600100.0000058.18598
WirePure metalCopper (Cu)7440-50-80.0518096.550000.23760
Pure metal layerGold (Au)7440-57-50.000190.350000.00086
Palladium (Pd)7440-05-30.001663.100000.00763
subTotal0.05365100.000000.24609
total21.80250100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.