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Chemical content 74HCU04BQ

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Type numberPackagePackage descriptionTotal product weight
74HCU04BQSOT762-1DHVQFN1418.01559 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93529364211511126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000231.000000.00129
FillerSilver (Ag)7440-22-40.0174475.000000.09683
PolymerAcrylic resinProprietary0.001406.000000.00775
Resin systemProprietary0.0041918.000000.02324
subTotal0.02326100.000000.12911
DieDoped siliconSilicon (Si)7440-21-30.26494100.000001.47064
subTotal0.26494100.000001.47064
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.76158
Iron (Fe)7439-89-60.167512.400000.92980
Phosphorus (P)7723-14-00.002090.030000.01162
Zinc (Zn)7440-66-60.006980.100000.03874
subTotal6.97956100.0000038.74174
Mould CompoundAdditiveNon hazardousProprietary0.313922.984001.74247
FillerSilica -amorphous-7631-86-90.367153.490002.03795
Silica fused60676-86-08.9230684.8200049.52968
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.105411.002000.58511
PigmentCarbon black1333-86-40.017250.164000.09577
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.389353.701002.16116
Epoxy resin systemProprietary0.166851.586000.92613
Phenolic resinProprietary0.237022.253001.31561
subTotal10.52000100.0000058.39388
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00983
Nickel (Ni)7440-02-00.1612391.000000.89495
Palladium (Pd)7440-05-30.014178.000000.07868
subTotal0.17718100.000000.98346
WirePure metalCopper (Cu)7440-50-80.0489196.550000.27149
Pure metal layerGold (Au)7440-57-50.000180.350000.00098
Palladium (Pd)7440-05-30.001573.100000.00872
subTotal0.05066100.000000.28119
total18.01559100.00000100.00000
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