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Chemical content 74LVCH244ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVCH244ABQ-Q100SOT764-1DHVQFN2028.00594 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352994981157126030 s123520 s3Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00305
FillerSilver (Ag)7440-22-40.0639675.000000.22838
PolymerAcrylic resinProprietary0.005126.000000.01827
Resin systemProprietary0.0153518.000000.05481
subTotal0.08528100.000000.30451
DieDoped siliconSilicon (Si)7440-21-30.31489100.000001.12436
subTotal0.31489100.000001.12436
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.80968
Iron (Fe)7439-89-60.260732.400000.93099
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03879
subTotal10.86381100.0000038.79110
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.74473
FillerSilica -amorphous-7631-86-90.571483.490002.04058
Silica fused60676-86-013.8892184.8200049.59379
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.58586
PigmentCarbon black1333-86-40.026850.164000.09589
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.16395
Epoxy resin systemProprietary0.259711.586000.92733
Phenolic resinProprietary0.368932.253001.31732
subTotal16.37492100.0000058.46945
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509691.000000.89609
Palladium (Pd)7440-05-30.022068.000000.07878
subTotal0.27578100.000000.98472
WirePure metalCopper (Cu)7440-50-80.0881196.550000.31462
Pure metal layerGold (Au)7440-57-50.000320.350000.00114
Palladium (Pd)7440-05-30.002833.100000.01010
subTotal0.09126100.000000.32586
total28.00594100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.