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Chemical content CBT3257APW-Q100

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Type numberPackagePackage descriptionTotal product weight
CBT3257APW-Q100SOT403-1TSSOP1660.39526 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690952118512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21927
PolymerAcrylic resinProprietary0.0258415.200000.04278
Resin systemProprietary0.011736.900000.01942
subTotal0.17000100.000000.28147
DieDoped siliconSilicon (Si)7440-21-30.21479100.000000.35564
subTotal0.21479100.000000.35564
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.97796
Iron (Fe)7439-89-60.475552.400000.78739
Phosphorus (P)7723-14-00.005940.030000.00984
Zinc (Zn)7440-66-60.019810.100000.03281
subTotal19.81448100.0000032.80800
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39341
Silica fused60676-86-031.0186878.3300051.35946
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.99965
PigmentCarbon black1333-86-40.079200.200000.13114
PolymerEpoxy resin systemProprietary3.509358.862005.81064
Phenolic resinProprietary2.339575.908003.87376
subTotal39.60000100.0000065.56806
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02498
Nickel (Ni)7440-02-00.4642592.300000.76869
Palladium (Pd)7440-05-30.015593.100000.02582
Silver (Ag)7440-22-40.008051.600000.01333
subTotal0.50298100.000000.83282
WirePure metalCopper (Cu)7440-50-80.09301100.000000.15400
subTotal0.09301100.000000.15400
total60.39526100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.