Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD1ETH1GLS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD1ETH1GLS-QSOD882BDDFN1006-20.928026 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346635403153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.01748076.0000001.883568
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00240810.4700000.259486
Phenolic resinProprietary0.00311213.5300000.335325
subTotal0.023000100.0000002.478379
DieDoped siliconSilicon (Si)7440-21-30.064000100.0000006.896359
subTotal0.064000100.0000006.896359
Lead FrameCopper alloyCopper (Cu)7440-50-80.38252095.63000041.218673
Magnesium (Mg)7439-95-40.0006000.1500000.064653
Nickel (Ni)7440-02-00.0119202.9800001.284447
Silicon (Si)7440-21-30.0026000.6500000.280165
Pure metal layerGold (Au)7440-57-50.0000400.0100000.004310
Nickel (Ni)7440-02-00.0022000.5500000.237062
Palladium (Pd)7440-05-30.0001200.0300000.012931
subTotal0.400000100.00000043.102241
Mould CompoundFillerSilica -amorphous-7631-86-90.0323997.9800003.491152
Silica fused60676-86-00.32517480.09200035.039268
PigmentCarbon black1333-86-40.0037680.9280000.405989
PolymerEpoxy resin systemProprietary0.0343078.4500003.696771
Phenolic resinProprietary0.0103532.5500001.115594
subTotal0.406000100.00000043.748774
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000150
Non hazardousProprietary0.0000170.0555000.001854
Tin solderTin (Sn)7440-31-50.03098199.9400003.338419
subTotal0.031000100.0000003.340424
WireImpurityNon hazardousProprietary0.0000000.0100000.000043
Pure metalGold (Au)7440-57-50.00402699.9900000.433781
subTotal0.004026100.0000000.433824
total0.928026100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.