Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD3V3T1BL-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD3V3T1BL-QSOD882DFN1006-20.914080 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346655083151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.831437
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.114541
Phenolic resinProprietary0.00135313.5300000.148018
subTotal0.010000100.0000001.093996
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000002.187992
subTotal0.020000100.0000002.187992
Lead FrameCopper alloyCopper (Cu)7440-50-80.38740994.49000042.382395
Magnesium (Mg)7439-95-40.0008200.2000000.089708
Nickel (Ni)7440-02-00.0129153.1500001.412896
Silicon (Si)7440-21-30.0028290.6900000.309492
Pure metal layerGold (Au)7440-57-50.0001230.0300000.013456
Nickel (Ni)7440-02-00.0052071.2700000.569644
Palladium (Pd)7440-05-30.0006970.1700000.076252
subTotal0.410000100.00000044.853842
Mould CompoundFillerSilica -amorphous-7631-86-90.10350023.00000011.322860
Silica fused60676-86-00.27000060.00000029.537896
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0135003.0000001.476895
Ion trapping agentBismuth (Bi)7440-69-90.0022500.5000000.246149
PigmentCarbon black1333-86-40.0022500.5000000.246149
PolymerEpoxy resin systemProprietary0.0315007.0000003.446088
Phenolic resinProprietary0.0270006.0000002.953790
subTotal0.450000100.00000049.229827
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000098
Non hazardousProprietary0.0000110.0555000.001214
Tin solderTin (Sn)7440-31-50.01998899.9400002.186680
subTotal0.020000100.0000002.187992
WireImpurityNon hazardousProprietary0.0000000.0100000.000045
Pure metalGold (Au)7440-57-50.00408099.9900000.446306
subTotal0.004080100.0000000.446350
total0.914080100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.