Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PIMN31PAS-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PIMN31PAS-QSOT1118DHUSON67.059960 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346660581152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.883858
PolymerAcrylic resinProprietary0.01560020.0000000.220964
subTotal0.078000100.0000001.104822
DieDoped siliconSilicon (Si)7440-21-30.184000100.0000002.606247
subTotal0.184000100.0000002.606247
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000036.252473
Magnesium (Mg)7439-95-40.0053820.2000000.076233
Nickel (Ni)7440-02-00.0853053.1700001.208289
Silicon (Si)7440-21-30.0185680.6900000.263003
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007623
Nickel (Ni)7440-02-00.0199130.7400000.282061
Palladium (Pd)7440-05-30.0018840.0700000.026681
subTotal2.691000100.00000038.116363
Mould CompoundFillerSilica -amorphous-7631-86-90.89424023.00000012.666361
Silica fused60676-86-02.33280060.00000033.042680
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1166403.0000001.652134
Ion trapping agentBismuth (Bi)7440-69-90.0194400.5000000.275356
PigmentCarbon black1333-86-40.0194400.5000000.275356
PolymerEpoxy resin systemProprietary0.2721607.0000003.854979
Phenolic resinProprietary0.2332806.0000003.304268
subTotal3.888000100.00000055.071134
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000105
Non hazardousProprietary0.0000910.0555000.001289
Tin solderTin (Sn)7440-31-50.16390299.9400002.321566
subTotal0.164000100.0000002.322959
WireImpurityNon hazardousProprietary0.0000050.0100000.000078
Pure metalGold (Au)7440-57-50.05495599.9900000.778397
subTotal0.054960100.0000000.778475
total7.059960100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.