Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 1PS70SB10

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
1PS70SB10SOT323SC-705.513204 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405491711512126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000000.544148
subTotal0.030000100.0000000.544148
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.030200
Carbon (C)7440-44-00.0007400.0400000.013422
Chromium (Cr)7440-47-30.0016650.0900000.030200
Cobalt (Co)7440-48-40.0079550.4300000.144290
Iron (Fe)7439-89-60.82602544.65000014.982667
Manganese (Mn)7439-96-50.0127650.6900000.231535
Nickel (Ni)7440-02-00.63899034.54000011.590175
Phosphorus (P)7723-14-00.0003700.0200000.006711
Silicon (Si)7440-21-30.0048100.2600000.087245
Sulphur (S)7704-34-90.0003700.0200000.006711
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.654153
Silver (Ag)7440-22-40.0429202.3200000.778495
subTotal1.850000100.00000033.555805
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.314267
PigmentCarbon black1333-86-40.0102000.3000000.185010
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.792273
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.378579
subTotal3.400000100.00000061.670129
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000125
Bismuth (Bi)7440-69-90.0000020.0010000.000042
Copper (Cu)7440-50-80.0000020.0010000.000042
Lead (Pb)7439-92-10.0000120.0050000.000209
Tin solderTin (Sn)7440-31-50.22997799.9900004.171386
subTotal0.230000100.0000004.171803
WirePure metalCopper (Cu)7440-50-80.003203100.0000000.058106
subTotal0.003203100.0000000.058106
total5.513204100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.