Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMBD353

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBD353SOT23TO-236AB7.661530 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9339122102151412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000000.522089
subTotal0.040000100.0000000.522089
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029943
Carbon (C)7440-44-00.0010200.0400000.013308
Chromium (Cr)7440-47-30.0056080.2200000.073194
Cobalt (Co)7440-48-40.0109610.4300000.143062
Iron (Fe)7439-89-61.22301047.98000015.963002
Manganese (Mn)7439-96-50.0219210.8600000.286123
Nickel (Ni)7440-02-00.92120936.14000012.023820
Phosphorus (P)7723-14-00.0005100.0200000.006654
Silicon (Si)7440-21-30.0066270.2600000.086502
Sulphur (S)7704-34-90.0005100.0200000.006654
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.782812
Silver (Ag)7440-22-40.0655092.5700000.855042
subTotal2.549000100.00000033.270117
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.846772
Triphenylphosphine603-35-00.0024400.0500000.031841
FillerSilica -amorphous-7631-86-93.51288072.00000045.850894
PigmentCarbon black1333-86-40.0024400.0500000.031841
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.552270
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.368180
subTotal4.879000100.00000063.681797
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001340
Tin solderTin (Sn)7440-31-50.18488999.9400002.413213
subTotal0.185000100.0000002.414661
WirePure metalCopper (Cu)7440-50-80.008530100.0000000.111339
subTotal0.008530100.0000000.111339
total7.661530100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.