74AVC4TD245
Parametrics
Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AVC4TD245BQ | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | DHVQFN16 | Bi-directional | Direction controlled | |||
74AVC4TD245BQ-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | DHVQFN16 | ||||
74AVC4TD245GU | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | XQFN16 | Bi-directional | Direction controlled | |||
74AVC4TD245PW | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 125 | 4.4 | 54 | TSSOP16 | Bi-directional | Direction controlled |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AVC4TD245BQ | 74AVC4TD245BQ,115 (935294167115) |
Active | 4TD245 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74AVC4TD245BQ-Q100 | 74AVC4TD245BQ-Q10X (935691579115) |
Active | 4TD245 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74AVC4TD245GU | 74AVC4TD245GU,115 (935294168115) |
Active |
XQFN16 (SOT1161-1) |
SOT1161-1 | SOT1161-1_115 | ||
74AVC4TD245PW | 74AVC4TD245PW,118 (935295415118) |
Active | C4TD245 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AVC4TD245BQ | 74AVC4TD245BQ,115 | 74AVC4TD245BQ | ||
74AVC4TD245BQ-Q100 | 74AVC4TD245BQ-Q10X | 74AVC4TD245BQ-Q100 | ||
74AVC4TD245GU | 74AVC4TD245GU,115 | 74AVC4TD245GU | ||
74AVC4TD245PW | 74AVC4TD245PW,118 | 74AVC4TD245PW |
Documentation (13)
File name | Title | Type | Date |
---|---|---|---|
74AVC4TD245 | 4-bit dual supply translating transceiver with configurable voltage translation; 3-state | Data sheet | 2024-06-25 |
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
avc4td245 | avc4td245 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT1161-1 | plastic, leadless extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 2.6 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-15 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
avc4td245 | avc4td245 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
Sample
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