Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
WLCSP6_SOT8090 | WLCSP6 | WLCSP6: wafer level chip-size package; 6 bumps | 2025-01-08 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
WLCSP6_SOT8090 | WLCSP6: wafer level chip-size package; 6 bumps | Package information | 2025-01-16 |
WLCSP6_SOT8090_341 | WLCSP6; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-03-28 |
Products in this package
GaN FETs
Type number | Description | Quick access |
---|---|---|
GANE7R0-100CBA | 100 V, 7.0 mOhm Gallium Nitride (GaN) FET in a 2.5 mm x 1.5 mm Wafer Level Chip-Scale Package (WLCSP) |