LSF0101
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LSF0101GM | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 302 | 7.2 | 153 | XSON6 | Bi-directional | AutoSense |
| LSF0101GW | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 273 | 46.6 | 161 | TSSOP6 | Bi-directional | AutoSense |
| LSF0101GX | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 521 | 22.4 | 278 | X2SON6 | Bi-directional | AutoSense |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| LSF0101GM | LSF0101GMX (935690956115) |
Active | h1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| LSF0101GW | LSF0101GWH (935690295125) |
Active | h1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| LSF0101GX | LSF0101GXZ (935690296147) |
Active | h1 |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
Documentation (13)
| File name | Title | Type | Date |
|---|---|---|---|
| LSF0101 | 1-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-07-25 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
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