LSF0108
8-bit bidirectional multi-voltage level translator; open-drain; push-pull
The LSF0108 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.
Features and benefits
Bidirectional voltage translation with no direction pin
Up translation
≤ 100 MHz; CL = 30 pF
≤ 50 MHz; CL = 50 pF
Down translation
≥ 100 MHz; CL = 30 pF
≥ 50 MHz; CL = 50 pF
Hot insertion
Bidirectional voltage level translation between:
0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
1.8 V and 2.5 V, 3.3 V and 5.0 V
2.5 V and 3.3 V and 5.0 V
3.3 V and 5.0 V
Low standby current
5 V tolerant I/O pins to support TTL
Low RON provides less signal distortion
High-impedance I/O pins for EN = Low.
Flow-through pinout for easy PCB trace routing.
Latch-up performance exceeds 100 mA per JESD78 class II level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +125 °C
Applications
GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure
Industrial
Personal computing
Parametrics
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
LSF0108BQ | LSF0108BQX (935690288115) |
Active | LSF0108 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
LSF0108PW | LSF0108PWJ (935690289118) |
Active | LSF0108 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
LSF0108BQ | LSF0108BQX | LSF0108BQ | ||
LSF0108PW | LSF0108PWJ | LSF0108PW |
Documentation (12)
File name | Title | Type | Date |
---|---|---|---|
LSF0108 | 8-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-07-25 |
AN90050 | Pin FMEA for LSF family | Application note | 2023-12-14 |
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lsf0108 | LSF0108 IBIS model | IBIS model | 2020-04-14 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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