Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content LSF0108BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
935690288115LSF0108BQXLSF0108BQSOT764 (DHVQFN20)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 8944 ppm; substance 1333-86-4: 957 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 8944 ppm; substance 1333-86-4: 957 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2280 ppm; substance 7440-05-3: 882 ppm; substance 7440-57-5: 109 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.06396075.0000000.227975
AdhesivePolymerResin system0.01535018.0000000.054714
AdhesivePolymerAcrylic resin0.0051176.0000000.018238
AdhesiveAdditiveNon hazardous0.0008531.0000000.003040
Adhesive Total0.085280100.0000000.303967
DieDoped siliconSilicon (Si)7440-21-30.369482100.0000001.316960
Die Total0.369482100.0000001.316960
Lead FrameCopper alloyCopper (Cu)7440-50-810.58916095.05708837.743390
Lead FrameCopper alloyIron (Fe)7439-89-60.2607362.3405830.929355
Lead FrameCopper alloyZinc (Zn)7440-66-60.0108640.0975240.038723
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0032590.0292560.011617
Lead FramePure metal layerNickel (Ni)7440-02-00.2509512.2527440.894474
Lead FramePure metal layerPalladium (Pd)7440-05-30.0220620.1980470.078635
Lead FramePure metal layerGold (Au)7440-57-50.0027580.0247580.009829
Lead Frame Total11.139790100.00000039.706023
Mould CompoundFillerSilica fused60676-86-013.88919984.82000049.505856
Mould CompoundPolymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.160118
Mould CompoundFillerSilica -amorphous-7631-86-90.5714843.4900002.036966
Mould CompoundAdditiveNon hazardous0.4886272.9840001.741635
Mould CompoundPolymerPhenolic resin0.3689272.2530001.314981
Mould CompoundPolymerEpoxy resin system0.2597061.5860000.925681
Mould CompoundFlame retardantFlame retardant, organic phosphorus compound0.1640771.0020000.584825
Mould CompoundPigmentCarbon black1333-86-40.0268550.1640000.095720
Mould Compound Total16.374910100.00000058.365782
WirePure metalCopper (Cu)7440-50-80.08323296.5500000.296668
WirePure metal layerPalladium (Pd)7440-05-30.0026723.1000000.009525
WirePure metal layerGold (Au)7440-57-50.0003020.3500000.001075
Wire Total0.086206100.0000000.307268
LSF0108BQ Total28.055668100.000000100.000000
Notes
Report created on 2024-10-26 17:48:52 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:48:52 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:48:52 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.