Block diagram
Products - Power
Nexperia value proposition
- Lower switch losses improve even more the thermal behaviour
- LFPAK and CFP (both clip-bond package) allow a high-efficiency DC/DC converter solutions, while reducing costs (less heating to dissipate)
- Standard packages MLPAK33 and MLPAK56 also available
- Therefore the possibility to go to higher switching frequency (FSW), which leads to smaller inductances and smaller capacities
- Best thermal performance thanks to clip-bond package - Rth 3x better than competition - and SiGe diodes that have no thermal runaway
MOSFET and GaN FET Handbook
Drawing on over 20 years’ of experience, the MOSFET and GaN FET Application Handbook: A Power Design Engineer’s Guide brings together a comprehensive set of learning and reference materials relating to the use of MOSFETs and GaN FETs in real world systems.
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