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Chemical content 74ALVC573D

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Type numberPackagePackage descriptionTotal product weight
74ALVC573DSOT163-1SO20522.88249 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352697371181212601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.8010080.100000.15319
PolymerResin systemProprietary0.1990019.900000.03806
subTotal1.00000100.000000.19125
DieDoped siliconSilicon (Si)7440-21-30.50000100.000000.09562
subTotal0.50000100.000000.09562
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8136.4580097.4700026.09726
Iron (Fe)7439-89-63.360002.400000.64259
Phosphorus (P)7723-14-00.042000.030000.00803
Zinc (Zn)7440-66-60.140000.100000.02677
subTotal140.00000100.0000026.77465
Mould CompoundFillerSilica -amorphous-7631-86-92.268000.600000.43375
Silica fused60676-86-0296.0874078.3300056.62599
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-823.058006.100004.40979
PigmentCarbon black1333-86-40.756000.200000.14458
PolymerEpoxy resin systemProprietary33.498368.862006.40648
Phenolic resinProprietary22.332245.908004.27099
subTotal378.00000100.0000072.29158
Pre-PlatingPure metal layerGold (Au)7440-57-50.032001.000000.00612
Nickel (Ni)7440-02-03.1040097.000000.59363
Palladium (Pd)7440-05-30.064002.000000.01224
subTotal3.20000100.000000.61199
WirePure metalGold (Au)7440-57-50.1806799.000000.03455
Palladium (Pd)7440-05-30.001821.000000.00035
subTotal0.18249100.000000.03490
total522.88249100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.