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Chemical content 74HC4094PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4094PW-Q100SOT403-1TSSOP1660.64000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300049118812601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21839
PolymerAcrylic resinProprietary0.0258415.200000.04261
Resin systemProprietary0.011736.900000.01934
subTotal0.17000100.000000.28034
DieDoped siliconSilicon (Si)7440-21-30.44945100.000000.74117
subTotal0.44945100.000000.74117
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.84890
Iron (Fe)7439-89-60.475552.400000.78421
Phosphorus (P)7723-14-00.005940.030000.00980
Zinc (Zn)7440-66-60.019810.100000.03268
subTotal19.81448100.0000032.67559
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39182
Silica fused60676-86-031.0186878.3300051.15218
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.98351
PigmentCarbon black1333-86-40.079200.200000.13061
PolymerEpoxy resin systemProprietary3.509358.862005.78719
Phenolic resinProprietary2.339575.908003.85813
subTotal39.60000100.0000065.30344
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02488
Nickel (Ni)7440-02-00.4642592.300000.76558
Palladium (Pd)7440-05-30.015593.100000.02571
Silver (Ag)7440-22-40.008051.600000.01327
subTotal0.50298100.000000.82944
WirePure metalCopper (Cu)7440-50-80.10310100.000000.17002
subTotal0.10310100.000000.17002
total60.64000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.