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Chemical content NBM7100ABQ

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Type numberPackagePackage descriptionTotal product weight
NBM7100ABQSOT763-1DHVQFN1621.83127 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691195115412601235Kuching, Malaysia; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36573
PolymerResin systemProprietary0.0198419.900000.09086
subTotal0.09968100.000000.45659
DieDoped siliconSilicon (Si)7440-21-30.75553100.000003.46075
subTotal0.75553100.000003.46075
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.84428
Iron (Fe)7439-89-60.198062.400000.90722
Phosphorus (P)7723-14-00.002480.030000.01134
Zinc (Zn)7440-66-60.008250.100000.03780
subTotal8.25236100.0000037.80064
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65799
FillerSilica -amorphous-7631-86-90.434103.490001.98844
Silica fused60676-86-010.5503084.8200048.32656
PigmentCarbon black1333-86-40.019900.160000.09116
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61533
Epoxy resin systemProprietary0.197771.590000.90591
Phenolic resinProprietary0.279872.250001.28195
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10809
subTotal12.43846100.0000056.97543
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00960
Nickel (Ni)7440-02-00.1906391.000000.87318
Palladium (Pd)7440-05-30.016768.000000.07676
subTotal0.20948100.000000.95954
WirePure metalCopper (Cu)7440-50-80.0731596.550000.33505
Pure metal layerGold (Au)7440-57-50.000270.350000.00121
Palladium (Pd)7440-05-30.002353.100000.01076
subTotal0.07576100.000000.34702
total21.83127100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.