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Chemical content NMUX1308PW-Q100

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Type numberPackagePackage descriptionTotal product weight
NMUX1308PW-Q100SOT403-1TSSOP1660.41771 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691414118412601235Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21919
PolymerAcrylic resinProprietary0.0258415.200000.04277
Resin systemProprietary0.011736.900000.01941
subTotal0.17000100.000000.28137
DieDoped siliconSilicon (Si)7440-21-30.24311100.000000.40239
subTotal0.24311100.000000.40239
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.96608
Iron (Fe)7439-89-60.475552.400000.78710
Phosphorus (P)7723-14-00.005940.030000.00984
Zinc (Zn)7440-66-60.019810.100000.03280
subTotal19.81448100.0000032.79582
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39326
Silica fused60676-86-031.0186878.3300051.34038
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.99817
PigmentCarbon black1333-86-40.079200.200000.13109
PolymerEpoxy resin systemProprietary3.509358.862005.80848
Phenolic resinProprietary2.339575.908003.87232
subTotal39.60000100.0000065.54370
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02498
Nickel (Ni)7440-02-00.4642592.300000.76840
Palladium (Pd)7440-05-30.015593.100000.02581
Silver (Ag)7440-22-40.008051.600000.01332
subTotal0.50298100.000000.83251
WirePure metalCopper (Cu)7440-50-80.08714100.000000.14423
subTotal0.08714100.000000.14423
total60.41771100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.